AIoT chip developer ESWIN nets RMB2.5 billion series C round Chinese AIoT chip and solution provider ESWIN has netted RMB2.5 billion(US$400 million) in Series C round financing, which was co-led by Goldstone Investment and China Internet Investment Fund. SAIC Capital, InnoVision Capital, IDG Capital, Legend Capital and CDB Capital also participated. After the completion of […]
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